{"created":"2023-06-19T07:34:44.114531+00:00","id":25,"links":{},"metadata":{"_buckets":{"deposit":"3166cd64-c266-4092-b010-b5e15bd3cf24"},"_deposit":{"created_by":3,"id":"25","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"25"},"status":"published"},"_oai":{"id":"oai:mejiro.repo.nii.ac.jp:00000025","sets":["1:18:23"]},"author_link":["21","22"],"item_10002_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2017-03-31","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"15","bibliographicPageEnd":"46","bibliographicPageStart":"35","bibliographic_titles":[{"bibliographic_title":"目白大学経営学研究"},{"bibliographic_title":"Mejiro Journal of Managemant","bibliographic_titleLang":"en"}]}]},"item_10002_description_19":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"pdf","subitem_description_type":"Other"}]},"item_10002_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"I n the ma nufacturing process of a ny mecha nical parts with spatially varied characteristics, controlling a characteristics distribution is important depending on its intended use. In the electroplating process, it is desirable to form a thin film with different thickness on different local positions on the base material. Therefore, it is necessary to achieve a specific profile of film thickness distribution. Although the conventional robust parameter design have been used to make a uniform film, it is difficult to design a custom profile of film thickness distribution under various constraints. Considering this situation, we propose a parameter design method to control a spatial distribution in a custom profile with a parameter design. Three regression parameters corresponding to feature quantities of a distribution are designed as multi-objects. The effect of the method will be verified for an electric plating process as a case study. Also an application to control the profile based on this approach will be introduced.","subitem_description_type":"Abstract"}]},"item_10002_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"目白大学"}]},"item_10002_rights_15":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"目白大学"}]},"item_10002_source_id_11":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11843415","subitem_source_identifier_type":"NCID"}]},"item_10002_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"1348-5776","subitem_source_identifier_type":"ISSN"}]},"item_10002_version_type_20":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"三井, 正"}],"nameIdentifiers":[{"nameIdentifier":"21","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"MITSUI, Tadashi","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"22","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2017-10-01"}],"displaytype":"detail","filename":"MJM_15_35.pdf","filesize":[{"value":"452.0 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"MJM_15_35.pdf","url":"https://mejiro.repo.nii.ac.jp/record/25/files/MJM_15_35.pdf"},"version_id":"87b3583b-9dd9-47ad-b449-7c7a4b7a29d2"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Design of experiments","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Robust parameter design","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Depiction variables","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Electroplating process","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Distribution profile feature quantities","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Parameter Design of Film Forming Process to Control Spatial Distribution of Film Thickness","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Parameter Design of Film Forming Process to Control Spatial Distribution of Film Thickness","subitem_title_language":"en"}]},"item_type_id":"10002","owner":"3","path":["23"],"pubdate":{"attribute_name":"公開日","attribute_value":"2017-11-10"},"publish_date":"2017-11-10","publish_status":"0","recid":"25","relation_version_is_last":true,"title":["Parameter Design of Film Forming Process to Control Spatial Distribution of Film Thickness"],"weko_creator_id":"3","weko_shared_id":3},"updated":"2023-06-19T07:58:23.006431+00:00"}